半導体名詞

• 亮點及熱點分析 (Leakage tracking ex. Hot spot, Liquid crystal)
• 元件特性分析 (Device Characteristic Analysis)
• 靜電保護電路故障分析 (ESD failed tracking)
• FIB電路修補工程之破壞性分析 (Circuit debugging ex. FIB)
• Focus Ion Beam (FIB) 雙束型聚焦離子束
• 剖面結構分析之破壞性分析 (Top view and cross-section check ex. OM, SEM, TEM)
• 晶片電性測試 WAT(Wafer Acceptance Test)
• 測試良率 CP Yield(Chip Probing Yield)
• 缺陷 Defect
• LPC (Lot In-Line Process Control)
• WIP (Work In Process)
• CP Bin (Circuit Probe)
• FT (Final Test)
• IC 開蓋 / 去封膠 (Decapsulation / Delid)
• 微光顯微鏡漏電分析 (Emission Microscopy)